On August 14, a research report released by Huatai Securities highlighted a significant shift in AI super-node cabinets—from outward expansion to inward convergence. This transformation is triggering a non-linear surge in AIDC power density. With the advent of next-generation cabinets, exemplified by NVIDIA Kyber and ByteDance AI Rack 3.0, boasting power outputs exceeding 500kW, challenges related to busbar sizing and heat dissipation under high current conditions are becoming increasingly apparent. Consequently, the adoption of 800V DC solutions has emerged as an inevitable necessity. The industrialization of 800V technology is anticipated to gather momentum on both domestic and international fronts.

The escalating demand for high-density, low-loss, and precisely controllable chip power supplies is poised to drive four pivotal trends in AI power supply and distribution: voltage elevation, multi-layer power redundancy, modular integration, and proactive system upgrades. Against this backdrop, power supply manufacturers proficient in delivering HVDC and HV IBC solutions, firms possessing electromechanical skid-mounted module capabilities and SST technology expertise, as well as automotive-grade 400V and 800V semiconductor and power semiconductor companies with robust interoperability with AIDC, are all poised to reap substantial benefits.