Defu Technology (301511.SZ) has announced its intention to issue A-shares to specific investors, aiming to raise a maximum of 2.8 billion yuan. Following the deduction of issuance expenses, the proceeds will be allocated to the development of a 50,000-ton AI copper foil project tailored for high-end electronic circuits, specifically for artificial intelligence applications, and to bolster working capital. This ambitious project will be undertaken by Defu Technology's wholly-owned subsidiary, Hupo New Materials, and will involve a total investment of 2.25 billion yuan. Out of this, it is proposed that 1.98 billion yuan of the raised funds be utilized. Once the project reaches full operational capacity, it is anticipated to produce 50,000 tons of high-end electronic circuit copper foil annually, with the products finding applications in areas such as AI servers. However, this issuance is still subject to the approval of the company's shareholders' meeting, a review by the Shenzhen Stock Exchange, and registration consent from the China Securities Regulatory Commission before it can proceed.