According to a research report by CICC, proximal heat dissipation and liquid cooling are poised to act in a complementary manner. Presently, the power consumption of GPUs within the H100, Blackwell, and Rubin series consistently exceeds the kilowatt threshold. The adoption of 3D packaging has spurred an escalation in localized heat flux within chips, thereby unveiling the thermal conduction bottleneck inherent in copper and aluminum materials. Diamond, renowned for its exceptionally high thermal conductivity and low thermal expansion coefficient, stands out as a prime candidate for swiftly dissipating chip hotspots. In industrial settings, diamond takes charge of evenly distributing heat in the vicinity of the chip, while liquid cooling manages system-wide heat dissipation at the cabinet level; these two approaches are not interchangeable. Looking ahead, it is anticipated that high-end AI servers will embrace a composite thermal solution that integrates a 'diamond heat sink with full liquid cooling'.