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Huatian Technology: Persistently Enhancing Packaging and Testing Prowess Across Diverse Domains, Memory Chips Included
2026-06-04 /
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Author：小编
Huatian Technology shared on an interactive platform that its core business lies in integrated circuit packaging and testing, with a firm grasp of cutting-edge packaging technologies like FC and TSV. The company is steadily bolstering its packaging and testing capabilities across a wide range of sectors, memory chips being a notable area of expansion.
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