On April 24, at the 2026 Beijing International Automotive Exhibition, Black Sesame Technologies showcased its groundbreaking 'FAD Tianyan' L3 autonomous driving platform. This platform is built upon the FAD 2.0 open platform and boasts a dual-chip architecture, incorporating the Huashan A2000U chips. Each chip delivers a remarkable 700TOPS of computational power and supports Transformer hardware acceleration along with mixed-precision computing capabilities. These two chips are interconnected at high speeds and feature mutual redundancy, adhering to the stringent ASIL-D safety requirements.

From a software perspective, the platform establishes a multi-tiered isolation and security framework. This includes a physically segregated MCU, an information security subsystem that complies with ISO 21434 standards, a self-developed ASIL-D-level functional safety subsystem, and a Linux SoC subsystem that is compatible with ASIL-B-level standards. The platform has been pre-engineered to align with the L3 national mandatory standards slated for implementation in 2027. It employs algorithm heterogeneity and dual-redundancy mechanisms to bolster decision-making robustness and deliver an unparalleled L3 performance experience.