Apple intends to release a 20th-anniversary commemorative model in September 2027, likely to be marketed as the iPhone 20 Pro. This model is expected to receive a comprehensive overhaul across design, display, interaction, imaging, and chipset—making it the most thorough redesign since the iPhone X in 2017. The exterior is said to adopt a four-curved all-glass design that minimizes, or even conceals, the metal frame, paired with a nearly bezel-less full screen to create the visual impression of a single pane of glass. The new phone is expected to feature under-display Face ID and an under-display front camera, achieving a punch-hole-free front—though whether the related solution can meet mass-production imaging standards remains uncertain, and the Dynamic Island may be retained. All physical buttons are set to become solid-state buttons with no mechanical travel, registering presses through pressure sensing and simulating feedback via haptic motors—reducing body openings while improving sealing and the unibody feel. On the display front, Apple is developing a new-generation OLED panel with Samsung, and deployment of the two display technologies COE and LTPO+ is expected to be delayed; the iPhone 20 Pro screen measures 6.41 inches, while the iPhone 20 Pro Max comes in at 6.96 inches—the latter possibly marketed at launch as close to a 7-inch specification. Under the hood, the phone is expected to be equipped with the A21 Pro chip built on a second-generation 2nm process, paired with vertically stacked DRAM to boost memory bandwidth and on-device AI performance, along with a silicon-anode battery to extend battery life without increasing body size. For imaging, it will switch to a self-developed image sensor featuring LOFIC technology, achieving up to 20 stops of dynamic range. In communications, it will be equipped with a third-generation Apple self-developed modem, which is expected to surpass comparable Qualcomm products in speed and AI features.