The competition in the smartphone market has intensified, with multiple manufacturers launching new products in September. The prices of high-end flagship models generally exceed 10,000 yuan, with some even reaching as high as 20,000 yuan. Currently, 2nm chips have become a focal point of contention. Apple's A20 Pro has taken the lead in mass production, monopolizing most of TSMC's 2nm production capacity. MediaTek has announced tape-out, but its demand is limited. Qualcomm has also joined the fray. The rising costs of wafer foundry services have passed pressure on to the end market. Meanwhile, manufacturers such as Huawei and Xiaomi are adhering to the path of self-developed chips, adopting W2W advanced packaging technology to explore new solutions for performance enhancement under process limitations. In addition, chip manufacturers are fully shifting towards the AI field. SoCs are evolving from a single NPU responsible for AI computing to a heterogeneous AI computing power network across the entire subsystem. However, the implementation of related application scenarios is still in its early stages.