Recently, high-definition physical images of the motherboards for the iPhone 18 Pro and iPhone 18 Pro Max have surfaced online, providing a glimpse into the internal layout of Apple’s upcoming flagship smartphones. These images particularly highlight the packaging method and chip area modifications of the A20 Pro, the first 2nm SoC (System on Chip) from Apple. The A20 Pro chip is manufactured using TSMC’s advanced 2nm process and is the first to incorporate WMCM (Wafer-Level Chip-Scale Multichip Module) packaging technology. This innovation shifts the memory from the top of the chip to the side, substantially enhancing heat dissipation efficiency.
Furthermore, the NPU (Neural Processing Unit) area within the A20 Pro has been expanded, bolstering on-device AI computing capabilities. The motherboard layout has also undergone optimization, with the power management chip relocated to the edge of the motherboard. This strategic placement aids in dispersing heat during both charging and discharging processes.
Additionally, the iPhone 18 Pro series is rumored to employ a design strategy that combines Apple’s self-developed C2 baseband with Qualcomm’s baseband. This hybrid approach aims to strike a balance between optimizing power consumption and supporting millimeter-wave technology.