As per data from Tianyancha, BOE Technology Group Co., Ltd. has recently been granted an invention patent titled 'A Printed Circuit Board, Its Preparation Method, and Display Device'. The patent, bearing the authorization announcement number CN112867237B, had its application submitted on February 23, 2021, and received the authorization announcement on October 14, 2025.

The printed circuit board covered by this patent features a rigid board section and a flexible board section. Specifically, the flexible board section is positioned along the outer edge of one side (the first edge) of the rigid board section. The rigid board section itself is constructed with a substrate, an adhesive film, a cover film, and a first metal layer. Notably, the surface of the cover film that is adjacent to the adhesive film is equipped with a diversion groove. This groove extends to another side (the second edge) of the rigid board section.

The ingenious design of this diversion groove ensures that any excess adhesive oozing out from the adhesive film is channeled through the groove to the periphery of the second edge. This effectively minimizes the amount of adhesive that flows into the flexible board section. Consequently, it reduces the space that needs to be reserved for adhesive overflow on the printed circuit board, leading to a more compact overall size. Moreover, this design enhances the product's integration and reliability, marking a significant advancement in printed circuit board technology.