The Financial Committee Office of the Shanghai Municipal Committee of the Communist Party of China, along with other relevant departments, has unveiled a series of strategic measures aimed at bolstering the development of the 'Technology Board' within the bond market. These initiatives are designed to facilitate the effective deployment of policy instruments, including bond risk-sharing mechanisms tailored for technological innovation and private enterprises, as well as the integration of the National Financing Guarantee Fund in Shanghai. Financial institutions are being actively encouraged to devise credit risk mitigation tools, establish a credit enhancement framework through central-local coordination, and foster the issuance of bonds dedicated to technological innovation. Additionally, by capitalizing on Shanghai's interest subsidy programs, a greater number of enterprises will receive support in issuing technological innovation bonds. Furthermore, there will be a concerted push towards deepening product innovation to empower technology firms in issuing equity-debt hybrid instruments, such as convertible bonds specifically designed for technological innovation.