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On May 6, Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. officially signed and settled a 12-inch semiconductor advanced packaging full-link project in Changshu Economic and Technological Development Zone, with a total investment of 500 million yuan. The project plans to construct a modern production base of approximately 13,000 square meters, focusing on the mass production lines for three core products: dicing, thinning, and JIG SAW. Upon completion, the project will have an annual production capacity of 1,200 sets of semiconductor equipment, a 140% increase over the original capacity, effectively addressing the shortage of regional high-end packaging equipment capacity and providing strong impetus for the development of the integrated circuit industry cluster.
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