China has made significant strides in the realm of flexible electronics manufacturing using liquid metal. Research teams from the Technical Institute of Physics and Chemistry at the Chinese Academy of Sciences have introduced a groundbreaking damage-free etching patterning technique. This innovation shatters the limitations of conventional methods, allowing for the creation of circuit patterns without any material wastage. It achieves an impressive resolution of 5 μm and is compatible with eight different substrate types. Additionally, the team has developed a shape-adaptive conformal electronics manufacturing technology, effectively tackling the challenges associated with producing three-dimensional curved electronic devices. These dual breakthroughs tackle two key obstacles in flexible electronics manufacturing, paving the way for comprehensive innovation across the entire production chain. They not only foster theoretical advancements but also exhibit immense application potential in areas such as wearable health monitoring, implantable diagnostic tools, and aerospace intelligent systems.