Search
TCL Technology Unveils Plan to Issue Up to 2 Billion Yuan in Sci-Tech Innovation Corporate Bonds
2025-12-16 /
Read about 0 minute
Author：小编
TCL Technology (000100.SZ) has announced its intention to issue sci-tech innovation corporate bonds with a maximum value of 2 billion yuan, aimed at bolstering the growth of the digital economy. The bond issuance will be split into two tranches: the first tranche will have a maturity period of 170 days, while the second tranche will extend over a 3-year term. Both tranches boast a AAA credit rating with a stable outlook and are classified as unsecured bonds. These bonds are set to be listed on the Shenzhen Stock Exchange. Additionally, the company has underscored potential risks, including fluctuations in market interest rates, investment returns, and macroeconomic conditions.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
