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Recently, during an investor relations event, ZTT made a significant announcement: the company has commenced bulk shipments of its 800G high-speed optical modules. Moreover, at OFC2026, ZTT debuted a 1.6T silicon photonics module, which is built on single-channel 200G technology. This innovative module incorporates a silicon photonics integrated chip, offering outstanding performance in terms of power efficiency, overall performance, and signal integrity. It is designed to meet the stringent requirements for ultra-high bandwidth and extremely low latency that are essential for next-generation AI clusters. Furthermore, ZTT has partnered with Huawei to pioneer the large-scale implementation of O-band anti-resonant hollow-core fibers for internal data center connections within China.
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