Hanmi Semiconductor Aims to Capture Entire HBM4 Thermal Compression Bonding Machine Market, Projecting Annual Revenue of KRW1.1 Trillion - Chip

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Hanmi Semiconductor Aims to Capture Entire HBM4 Thermal Compression Bonding Machine Market, Projecting Annual Revenue of KRW1.1 Trillion

2 week ago / Read about 0 minute

Author：小编

Hanmi Semiconductor, leveraging its cutting-edge technology, is poised to secure all orders for the sixth-generation high-bandwidth memory (HBM4) thermal compression bonding machines. The company anticipates a surge in demand for these devices and predicts that its sales for this year could double those of last year, potentially reaching KRW1.1 trillion.

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