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Samsung Electronics: Current Thermal Compression Bonding Insufficient for 20-Layer Stacked HBM Memory Production
1 day ago /
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Author：小编
Samsung Electronics identifies 16-layer stacking as the pivotal step in transitioning HBM memory technology from Thermal Compression Bonding (TCB) to Hybrid Bonding (HCB). The company asserts that HCB technology is indispensable for the production of HBM with 16 layers or more.
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