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Micro-Tech Achieves Mass Delivery of Wafer-Level Hybrid Bonding Equipment
1 week ago /
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Author：小编
Micro-Tech's proprietary, fully automated wafer-level hybrid bonding equipment has triumphantly reached new customers, heralding another pivotal collaboration for the company within the semiconductor industry. Boasting high precision, robust stability, and autonomous mastery of core technologies, this equipment has passed through rigorous market scrutiny, infusing fresh momentum into the advancement of domestic semiconductor equipment.
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