Search
Tongguan Copper Foil: High-Volume Low-Profile (HVLP) Copper Foil Fully Booked, Integrating into Leading CCL Manufacturers' Supply Chains
1 week ago /
Read about 0 minute
Author：小编
Tongguan Copper Foil proudly announces the successful integration of its High-Volume Low-Profile (HVLP) copper foil into the supply chains of several prominent CCL manufacturers, with orders brimming. Characterized by its ultra-smooth surface, minimal loss, and exceptional stability, this advanced copper foil is pivotal in applications within the burgeoning 5G communications and AI sectors. Presently, the second-generation product stands as the flagship offering, meeting the surging market demand.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
