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Investing 14 Billion Korean Won, Justem Spearheads Development of HBM Hybrid Bonding Equipment
4 week ago /
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Author：小编
Justem, a leading Korean manufacturer of wafer fabrication equipment, has embarked on a pioneering project to develop hybrid bonding equipment for next-generation high-bandwidth memory (HBM). This ambitious undertaking, backed by a total investment of 14 billion Korean won, includes a direct government allocation of 7.5 billion Korean won from the Ministry of Trade, Industry, and Energy. The goal is to create a hybrid bonding stacking solution tailored specifically for very large-scale integrated circuit HBM.
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