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Huasuo Technology and Haimen Ink Deal for 500 Million Yuan Semiconductor Equipment Manufacturing Base
2 day ago /
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Author：小编
Haimen High-tech Zone and Huasuo Technology have officially sealed an investment accord for a wafer grinding equipment manufacturing project, entailing a total investment of 500 million yuan. Huasuo Technology stands as the sole domestic enterprise to achieve comprehensive localization of semiconductor grinding equipment, effectively surmounting foreign technical barriers. The venture will encompass research and development, production, as well as packaging of semiconductor grinding and polishing equipment, all within the confines of Haimen.
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