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Establishment of SEMI 3DIC Advanced Packaging Manufacturing Alliance Announced
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Author：小编
The SEMICON Taiwan 2025 event, set to take place in September, will mark a pivotal moment in the global semiconductor industry. Amidst the burgeoning demand for AI chips and High-Performance Computing (HPC), the sector is ushering in a new epoch of advanced packaging. This year's exhibition promises to spotlight groundbreaking packaging technologies, encompassing 3D Integrated Circuits (3DIC), Fan-Out Panel-Level Packaging (FOPLP), Chiplets, and Co-Packaged Optics (CPO). Notably, the highly anticipated SEMI 3DIC Advanced Packaging Manufacturing Alliance (SEMI 3DICAMA) will be officially launched at this prestigious event, underscoring the dynamic innovation and evolution of semiconductor packaging technology.
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