On July 2, VeriSilicon announced the successful conclusion of its private placement of shares to select investors, securing a total sum of RMB 1.807 billion. The funds garnered will primarily support the research and development of Chiplet solution platforms in the domains of AIGC and smart mobility. Additionally, the investment will propel strategic initiatives such as the R&D and industrialization of next-generation IPs tailored for AIGC, graphics processing, and other cutting-edge applications.