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Xingtong Semiconductor Inks Deal for 4.5 Billion Investment in Foshan's 'Chip Testing and Packaging Base Project'
1 week ago /
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Author：小编
On June 27th, Foshan Xingtong Semiconductor Co., Ltd. secured a 90-mu industrial plot in the Nanzhuang High-end Precision Smart Manufacturing Industrial Park of Chancheng District. The projected investment is estimated at 4.5 billion yuan, with an anticipated annual output value of 3 billion yuan once full capacity is achieved. This milestone initiative will establish the largest chip testing and packaging base in the Greater Bay Area, serving as a pivotal component in Chancheng's endeavor to construct a comprehensive 'core' industrial chain encompassing 'design-manufacturing-packaging and testing-application'. This strategic move is poised to accelerate the development of the high-tech industry in the region.
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