In a collaboration between the team of Ding Guqiao and He Peng from the Shanghai Institute of Microsystem and Information Technology at the Chinese Academy of Sciences, and the team of Wang Gang from Ningbo University, a groundbreaking study has been published in the esteemed journal Advanced Functional Materials. The research proposes a novel method utilizing aramid film as a precursor to fabricate a low-defect, large-grain, and highly oriented biaxially oriented graphite film with exceptional thermal conductivity through a high-temperature graphitization process.

This innovative graphite film boasts an impressive in-plane thermal conductivity (Kin) of up to 1754 W/m·K and an out-of-plane thermal conductivity (Kout) exceeding 14.2 W/m·K, despite its remarkably thin profile of just 40 micrometers. This remarkable achievement holds significant implications in the realm of materials science, marking a significant step forward in the development of advanced thermal management materials.