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Apple to Utilize TSMC's Advanced WMCM and SoIC Packaging in A20 and Server Chips
1 week ago /
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Author：小编
Scheduled for release next year, the initial batch of 2nm chips is anticipated to mark Apple's debut of the A20 and A20 Pro chips in the iPhone 18 series, leveraging this cutting-edge technology. Furthermore, it is reported that in 2026, Apple will introduce two novel packaging technologies. The next-generation A20 chips, based on TSMC's second-generation 2nm process, will be premiered in the iPhone 18 Pro, 18 Pro Max, and folding screen models. These chips will adopt Wafer-level Multi-Chip Module (WMCM) packaging, which integrates components like SoC and DRAM directly at the wafer level. This integration enhances signal transmission efficiency and thermal management, offering Apple greater design flexibility.
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