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Intel executives have recently revealed a strategic shift in chip manufacturing technology, moving away from traditional photomask techniques towards innovative transistor architectures. Looking ahead, the company intends to lean more heavily on advanced precision etching and material deposition technologies, while aiming to diminish its reliance on High-NA EUV (High Numerical Aperture Extreme Ultraviolet Lithography) equipment. Despite having secured five High-NA EUV machines from ASML, Intel has not yet committed fully to utilizing them for large-scale production. Additionally, TSMC has indicated that its A14 process does not absolutely necessitate the use of High-NA EUV equipment. As process technology inches closer to its physical constraints, the semiconductor industry appears to be exploring more cost-effective avenues for technological advancement.
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