Samsung Electronics has achieved a new milestone in the high-end memory chip market. Building on its success with AMD, the company has successfully secured a supply contract for the fifth-generation High Bandwidth Memory (HBM3E) from Broadcom, a leading global chip design firm. According to reports, Samsung's 8-layer stacked HBM3E product destined for Broadcom has successfully completed certification testing and is now poised for mass production and delivery.