TSMC's Arizona plant has successfully initiated production of the inaugural batch of chips for Apple, NVIDIA, and AMD, leveraging the advanced N4 process technology. Notably, NVIDIA's Blackwell AI GPU chips will be dispatched to Taiwan for the crucial packaging phase, highlighting the pivotal role of packaging within the supply chain. To bolster its domestic capabilities, TSMC is partnering with Amkor to establish advanced packaging facilities in the United States, with aspirations of achieving independent packaging in the future. Furthermore, this facility is also tasked with the manufacturing of Apple processors and AMD's fifth-generation EPYC processors, with expansion plans underway to incorporate 3nm and 2nm processes. In parallel, United Microelectronics Corporation (UMC) and Qualcomm are collaborating on the development of WoW packaging technology to cater to the burgeoning demand for AI chips.