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Amidst the rapid advancement of 5G and AI technologies, the computational prowess of power chips has soared, yet the challenge of heat dissipation has emerged as a critical bottleneck hindering their further development. To overcome this hurdle, Awinic Electronics has unveiled a groundbreaking micropump liquid cooling solution tailored for active heat dissipation. Leveraging piezoelectric ceramic technology, this solution boasts ultra-low power consumption, exceptional thinness and flexibility, along with highly efficient heat dissipation capabilities. Comprising a liquid cooling drive chip, a piezoelectric micropump, and an ultra-flexible liquid cooling diaphragm, it adeptly addresses the heat dissipation challenges faced by high-performance, miniaturized devices, thereby offering robust support to drive industry innovation and progress.
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