In a collaborative briefing this week, the Memory System Laboratory at the Korea Advanced Institute of Science and Technology (KAIST), along with the TERA Interconnect and Packaging Team, unveiled an ambitious roadmap for the evolution of High Bandwidth Memory (HBM) standards and accelerator platforms. This roadmap spans five generations, from HBM4 to HBM8, with each iteration promising substantial improvements in memory capacity, bandwidth, and packaging sophistication.