Semiconductor devices are continually evolving towards smaller sizes and enhanced performance, with the impact of surface and interface atomic-level structures on device performance becoming increasingly significant. Surface and interface defects can hinder carrier mobility, elevate resistance, and potentially cause device aging and failure, thereby severely compromising device stability and lifespan. In sectors such as LED, photovoltaic, and detection sensing, interface defects directly influence key performance metrics like quantum efficiency and sensor sensitivity, posing a significant hurdle for technological advancements. Furthermore, the interface characteristics of new semiconductor materials diverge markedly from those of traditional materials, necessitating in-depth research to pave the way for innovative device developments. In the realm of integrated circuit manufacturing, controlling surface and interface defects stands as a pivotal challenge in achieving finer process nodes.