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Xinde Semiconductor Awarded Patent for Innovative "Drop-Resistant Device and Component Wire Bonder"
4 day ago /
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Author：小编
Jiangsu Xinde Semiconductor Technology Co., Ltd. has been granted a patent titled "A Drop-resistant Device and Its Component Wire Bonder," with the authorization announcement number CN222483290U. The patent application was submitted on December 11, 2023, and was successfully awarded on February 14, 2025. This groundbreaking device employs a robust support frame, rollers, and other innovative designs to prevent sagging and impact with support rods during transportation, ultimately enhancing both production efficiency and product quality.
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