Search
Micron Unveils HBM4 Samples: 12-Layer 36GB Modules with 2 TB/s Bandwidth
2025-06-11 /
Read about 0 minute
Author：小编
Micron has achieved substantial advancements in the HBM4 architecture, stacking 12 DRAM chips to deliver a whopping 36GB of capacity per package. The company has announced its intention to dispatch the initial engineering samples to its key partners in the forthcoming weeks, setting the stage for full-scale production to commence in early 2026. HBM4 boasts an improvement of over 20% in energy efficiency and a remarkable 60% enhancement in performance compared to its predecessor, empowering AI accelerators to respond more swiftly and execute efficient inference operations.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
