Founder Technology Aims to Raise up to 1.98 Billion Yuan for AI and High-Density Interconnect Circuit Board Industrial Base Development - Chip

7 x 24 Track global technological trends

Hot Topic

Day

News Topic

Founder Technology Aims to Raise up to 1.98 Billion Yuan for AI and High-Density Interconnect Circuit Board Industrial Base Development

2025-06-10 / Read about 0 minute

Author：小编

Founder Technology intends to issue A-shares to a select group of no more than 35 investors, encompassing its controlling shareholder, with the objective of raising a maximum aggregate amount of 1.98 billion yuan. Upon deduction of issuance-related expenses, these funds will be exclusively allocated towards the AI and High-Density Interconnect Circuit Board Industrial Base Project.

Previous page：Hygon Information Announces Investor Briefing on S...

Next page：BOE Vietnam's New Factory Commences Mass Productio...

Return to List

Hot Reading

2 day ago

An Apple Robot could be in your home soon – and it's powered by Siri

1 day ago

Is GPT-5 really worse than GPT-4o? Ars puts them to the test.

1 day ago

Lawyers File AI Slop in Murder Case

1 day ago

New Research Finds That ChatGPT Secretly Has a Deep Anti-Human Bias