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NVIDIA Unveils Tape-outs for Next-Gen Rubin GPU and Vera CPU, Set for Trial Production This Month
1 week ago /
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Author：小编
NVIDIA's latest AI chips, the Rubin GPU and Vera CPU, are set to complete their design finalization (Tape-out) this month, with customer samples anticipated as early as September. The Rubin GPU leverages TSMC's cutting-edge 3rd generation 3nm (N3P) process node and advanced CoWoS-L packaging technology, marking the first time it supports 8-layer HBM4 high-bandwidth memory. Mass production of the Rubin GPU is scheduled for early 2026. The Vera CPU, which will be launched alongside the Rubin GPU to form the Vera Rubin superchip, is poised to potentially succeed the existing Grace Hopper superchip.
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