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SpaceX Embarks on Advanced Chip Packaging, Utilizing the Industry's Largest Substrate
1 day ago /
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Author：小编
Elon Musk's SpaceX is set to delve into the realm of fan-out panel-level packaging (FOPLP) by constructing its very own chip packaging facility in Texas. This ambitious project will employ the industry's largest substrate, measuring an impressive 700mm×700mm. Currently, SpaceX relies on external partners like STMicroelectronics for most of its chip packaging needs, with some contracts being outsourced to Innolux for manufacturing.
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