CoreSource New Materials, Manufacturer of High-Thermal-Conductivity Packaging Interconnects, Secures Series C Funding Exclusively from Xiaomi

1 week ago / Read about 0 minute

Author：小编

Shenzhen CoreSource New Materials Co., Ltd. has recently closed its Series C funding round, with Xiaomi Group as the sole investor. CoreSource New Materials specializes in the R&D, production, sales, and technical services of semiconductor thermal management packaging materials. Its portfolio showcases nano-metal products, offering high-efficiency heat dissipation and highly dependable solutions tailored for power semiconductors and advanced integrated circuits. The proceeds from this funding round will be dedicated to advancing the research and development, as well as the industrialization of silicon carbide module packaging materials.

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