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ESWIN Unveils Patent for Advanced "Secondary Chamfering Method, System, Computing Device, and Storage Medium"
2025-05-31 /
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Author：小编
Xi'an ESWIN Material Technology Co., Ltd. has recently announced a groundbreaking patent titled "Secondary Chamfering Method, Secondary Chamfering System, Computing Device, and Storage Medium," bearing the application publication number CN119610427A, published on March 14, 2025. This patent revolutionizes the process of silicon wafer refinement by introducing a method to meticulously measure and adjust the thickness of silicon wafers during secondary chamfering. It employs a correction groove specifically designed for this purpose, ensuring that silicon wafers with varying thicknesses achieve the desired edge shape with precision.
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