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Shanghai Xinmi Technology Awarded Patent for 'Sealant for Electrostatic Chuck Gaps and Its Preparation & Application'
2025-05-31 /
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Author：小编
Shanghai Xinmi Technology Co., Ltd. has recently been granted a patent titled 'Sealant for Gaps in Electrostatic Chucks and Its Preparation Method and Application', with authorization announcement number CN117777941B, announced on March 14, 2025. The patent application was submitted on November 22, 2023. This patent specifically addresses sealing technology aimed at gaps in electrostatic chucks, with the potential to significantly enhance the sealing performance of semiconductor equipment.
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