Baidu Intelligent Cloud has unveiled the Kunlun Super Node, an innovative solution that integrates 64 Kunlun XPU cards within a single cabinet. This breakthrough design boasts an 8-fold increase in interconnection bandwidth between cards, resulting in a remarkable 10-fold enhancement in overall cabinet training performance and a stunning 13-fold improvement in single-card inference performance. Leveraging Baidu Tianchi's advanced AI high-density liquid-cooled cabinet technology, the Kunlun Super Node facilitates ultra-high-density computing power deployment using 1U4 cards, which can be effortlessly maintained by a single individual. This sophisticated node effectively reduces the core chip temperature by over 20℃, ensuring the stable operation of XPUs. Additionally, it is fully compatible with a wide range of power supply environments in data centers, supporting seamless deployment in both air-cooled and liquid-cooled facilities.