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The 'Tech Board' of the Bond Market Accelerates, Steering Capital Towards Technological Innovation
2025-05-28 /
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Author：小编
From May 9 to May 27, a total of 137 technological innovation bonds have been issued, amounting to 322.91 billion yuan. This rapid pace signifies the burgeoning development of the 'Tech Board' within the bond market. According to Wind data, this momentum is fueled by the concerted rollout of various policies and the enthusiastic response from market entities. Experts underscore that the enhancement of the multi-tiered bond product system will more adeptly address the financing needs of technology enterprises across different lifecycle stages, thereby fostering the influx of funds into technological innovation.
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