Search
SpaceX has prioritized the adoption of Fan-Out Panel-Level Packaging (FOPLP) technology and aims to expand its FOPLP production capabilities to cater to the heightened integration and large-scale manufacturing demands of forthcoming low-orbit satellites. According to reports, SpaceX has entered into a Non-Recurring Engineering (NRE) contract with Innolux Corporation, aiming to expedite the mass production of FOPLP technology. This collaboration presents a significant opportunity for Innolux to secure substantial orders for power management chips and strive towards achieving mass production of FOPLP by 2025. The FOPLP technology promises substantial improvements in area utilization, package dimensions, and heat dissipation efficiency, which are vital for SpaceX to streamline the vertical integration of its satellite supply chain and minimize unit costs.
-
C114 Communication Network -
Communication Home
