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Samsung Aims to Transition to Glass Interposers by 2028 for Enhanced Performance and Cost Efficiency
2025-05-25 /
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Author：小编
Samsung Electronics is poised to revolutionize chip packaging with the introduction of glass substrates by 2028, marking a pivotal shift away from traditional silicon-based interposers towards glass interposers. This move, as reported by ETNews, represents Samsung's first official roadmap for this groundbreaking development, signaling a significant advancement in the realm of semiconductor innovation.
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