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Depon Technology: Breakthrough in Advanced Packaging Materials, Domestic Substitution Achieved; Chip-Level Thermal Conductivity Materials Reach Verification Phase
2025-05-22 /
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Author：小编
In an institutional survey, Depon Technology disclosed that the company has successfully shattered international monopolies, achieving domestic substitution for advanced packaging materials including chip-level underfill, AD glue, and die attach films (DAF/CDAF), and has completed small-batch deliveries. Notably, the chip-level thermal interface material (TIM1) has advanced to the client verification stage. Furthermore, the volume of mature products such as UV films, die attach glues, and mid-to-high-end thermal conductive materials continues to grow, markedly bolstering the company's comprehensive solution capabilities.
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