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Qimingxin's 'Chip Packaging and Testing Project' Launches in Qidong with a Total Investment of 1.1 Billion Yuan
2025-05-22 /
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Author：小编
On May 20th, the groundbreaking ceremony for the Qimingxin Semiconductor Technology Project took place in Qidong. This ambitious project is set to unfold in two distinct phases. The initial phase entails an investment of 300 million yuan, with a significant portion of 120 million yuan allocated for equipment. This phase is anticipated to generate an annual output value of 270 million yuan. Moving forward, the second phase will witness a substantial escalation in equipment investment, rising to 800 million yuan, with projections indicating an annual output value that could soar up to 1.2 billion yuan.
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