The latest report from SEMI reveals that, despite a 7% quarter-over-quarter decline, global semiconductor capital expenditure witnessed a robust 27% year-over-year growth in the first quarter of 2025. This significant expansion is predominantly fueled by sustained investments in advanced logic chips, high-bandwidth memory (HBM), and advanced packaging technologies that underpin AI applications. Notably, memory-related capital expenditure soared by 57% year-over-year, while non-memory expenditures also registered a healthy 15% increase.
