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Agency Insight: Elevated Manufacturing Standards for HBM4 Push Premium Expectations Beyond 30%
2025-05-22 /
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Author：小编
According to the latest research by TrendForce, the burgeoning demand for AI servers has propelled the advancement of High Bandwidth Memory (HBM) technology. Notably, the three leading original equipment manufacturers are intensifying their R&D efforts towards HBM4 products. The augmentation in the I/O count of HBM4 has necessitated more intricate chip designs and larger wafer areas, prompting some suppliers to adopt a logic chip architecture to bolster performance. This, in turn, has further escalated costs. When HBM3e was introduced, it commanded a premium of roughly 20%; however, it is anticipated that HBM4, given its heightened manufacturing complexity, will surpass a 30% premium.
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