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Phytium Information Unveils Patent for Innovative Packaging Substrate, Design Method, and Electronic Device
2025-05-19 /
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Author：小编
Phytium Information Technology Co., Ltd., a leading player in the software and information technology service industry since its inception in 2014, has recently announced a groundbreaking patent titled "A Packaging Substrate, Design Method Thereof, and Electronic Device." The patent, bearing the application publication number CN119627014A, was published on March 14, 2025.
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