Governor Pan Gongsheng of the People's Bank of China has announced that the necessary policies and preparations for the 'Tech Board' in the bond market are now in place. Several institutions have enthusiastically responded by unveiling their issuance plans, collectively aiming for a total issuance of approximately RMB 40 billion. As of May 8, 36 enterprises have declared their intention to issue science and technology innovation bonds in the interbank market, with an issuance scale of RMB 21 billion. Additionally, 14 more enterprises have registered and announced their plans, targeting a scale of RMB 18 billion. These enterprises span multiple provinces and cities, encompassing diverse technological innovation areas such as artificial intelligence and chip manufacturing. The funds raised through these bonds will be allocated towards enhancing the enterprises' scientific and technological innovation capabilities.