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Yangjie Technology Initiates Construction of SiC Automotive-Grade Power Semiconductor Module Packaging Project
2025-05-10 /
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Author：小编
On May 9, Yangjie Technology officially announced the commencement of its SiC Automotive-Grade Power Semiconductor Module Packaging Project. This project, with a total investment of RMB 1 billion, is dedicated to the development of third-generation semiconductor products, including automotive-grade frame-type and plastic-encapsulated IGBT modules, as well as SiC MOSFET modules. The goal is to achieve international leading standards and facilitate import substitution. Upon reaching full operational capacity, the project is anticipated to generate an annual sales volume of RMB 1 billion and an annual tax revenue of RMB 30 million, thereby providing a substantial boost to the local economy.
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